Innovation Park at Notre Dame client Indiana Integrated Circuits (IIC) is working to commercialize a technology licensed through the University of Notre Dame called Quilt Packaging™, designed to streamline microchip packaging, resulting in lower costs, greater speed and higher efficiency.
Co-founder and chief technical officer Gary Bernstein, Frank M. Freimann Professor of Electrical Engineering at the University of Notre Dame, is an inventor of Quilt Packaging, a new way of interconnecting microchips to eliminate data transfer issues, increase the performance of electronic systems and reduce energy.
"Our business model is licensing and contract R&D - to do prototyping to get other people to license the technology extensively," explained Jason Kulick, IIC president and co-founder. "We are very strong in fabrication using Notre Dame’s Nanofabrication Facility. A major benefit of Innovation Park has been the proximity to the nanofab facilities."
Recently Park experts connected IIC to critical advisory relationships – one with a Fortune 500 semiconductor company and another with a seasoned semiconductor venture investor.
"These conversations helped us in terms of company development, go to market strategy and funding sources," Kulick said. "It helped us understand where to focus our efforts and get feedback on team building. From a business standpoint Innovation Park has made critical connections to strong advisory support."
The latest IIC developments include:
"In addition to the great community South Bend offers, Innovation Park coupled with the Notre Dame Nanofabrication Facility offers an exceptional opportunity for high tech start ups," Bernstein said. "I expect other start-up companies to choose to locate to South Bend to have this type of access."